Preparation method of low-temperature integrated mold-pressing conductive rubber plate for cover plate of electronic case
The invention relates to a preparation method of a low-temperature integrated mold-pressing conductive rubber plate for a cover plate of an electronic case, belongs to the technical field of conductive rubber plate preparation and provides a preparation method of the low-temperature integrated mold-...
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| creator | ZHANG RUI REN SHENGPING YANG XIAOJIONG WANG XIAOMING WANG SHENGLI LI YANKUI |
| description | The invention relates to a preparation method of a low-temperature integrated mold-pressing conductive rubber plate for a cover plate of an electronic case, belongs to the technical field of conductive rubber plate preparation and provides a preparation method of the low-temperature integrated mold-pressing conductive rubber plate which comprehensively improves the overall salt mist resisting performance of the case. The preparation method comprises steps as follows: an aluminum plate is fixed on a handling frame and is coated with an adhesive by an automatic rubber coating machine, after the adhesive is cured and does not flow, a sizing material is laid to a mixing mill and is prepared from rubber, a vulcanizing agent and composite conductive powder through mixing, the resistance value is smaller than 2 m omega, the materials are subjected to one-time pressing composite forming in an automatic vulcanizer after laying, parameters in the automatic vulcanizer are as follows: the vulcanizing temperature is 40-70 |
| format | Patent |
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The preparation method comprises steps as follows: an aluminum plate is fixed on a handling frame and is coated with an adhesive by an automatic rubber coating machine, after the adhesive is cured and does not flow, a sizing material is laid to a mixing mill and is prepared from rubber, a vulcanizing agent and composite conductive powder through mixing, the resistance value is smaller than 2 m omega, the materials are subjected to one-time pressing composite forming in an automatic vulcanizer after laying, parameters in the automatic vulcanizer are as follows: the vulcanizing temperature is 40-70</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160420&DB=EPODOC&CC=CN&NR=105504817A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160420&DB=EPODOC&CC=CN&NR=105504817A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG RUI</creatorcontrib><creatorcontrib>REN SHENGPING</creatorcontrib><creatorcontrib>YANG XIAOJIONG</creatorcontrib><creatorcontrib>WANG XIAOMING</creatorcontrib><creatorcontrib>WANG SHENGLI</creatorcontrib><creatorcontrib>LI YANKUI</creatorcontrib><title>Preparation method of low-temperature integrated mold-pressing conductive rubber plate for cover plate of electronic case</title><description>The invention relates to a preparation method of a low-temperature integrated mold-pressing conductive rubber plate for a cover plate of an electronic case, belongs to the technical field of conductive rubber plate preparation and provides a preparation method of the low-temperature integrated mold-pressing conductive rubber plate which comprehensively improves the overall salt mist resisting performance of the case. The preparation method comprises steps as follows: an aluminum plate is fixed on a handling frame and is coated with an adhesive by an automatic rubber coating machine, after the adhesive is cured and does not flow, a sizing material is laid to a mixing mill and is prepared from rubber, a vulcanizing agent and composite conductive powder through mixing, the resistance value is smaller than 2 m omega, the materials are subjected to one-time pressing composite forming in an automatic vulcanizer after laying, parameters in the automatic vulcanizer are as follows: the vulcanizing temperature is 40-70</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAURbs4iPoPzw8otGjRVYriJA7uJU1vayDNCy9pxb83gzg73Xs5h7vM3neBV6KiYUcj4pM74p4sv_KI0SORSUDGRQypo6ORbZd7QQjGDaTZdZOOZgbJ1LYQ8jZp1LMkNv92-oSFjsLOaNIqYJ0temUDNt9cZdvL-VFfc3huELzScIhNfSuLqir2x_Jw2v3jfACZCEdy</recordid><startdate>20160420</startdate><enddate>20160420</enddate><creator>ZHANG RUI</creator><creator>REN SHENGPING</creator><creator>YANG XIAOJIONG</creator><creator>WANG XIAOMING</creator><creator>WANG SHENGLI</creator><creator>LI YANKUI</creator><scope>EVB</scope></search><sort><creationdate>20160420</creationdate><title>Preparation method of low-temperature integrated mold-pressing conductive rubber plate for cover plate of electronic case</title><author>ZHANG RUI ; REN SHENGPING ; YANG XIAOJIONG ; WANG XIAOMING ; WANG SHENGLI ; LI YANKUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105504817A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG RUI</creatorcontrib><creatorcontrib>REN SHENGPING</creatorcontrib><creatorcontrib>YANG XIAOJIONG</creatorcontrib><creatorcontrib>WANG XIAOMING</creatorcontrib><creatorcontrib>WANG SHENGLI</creatorcontrib><creatorcontrib>LI YANKUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG RUI</au><au>REN SHENGPING</au><au>YANG XIAOJIONG</au><au>WANG XIAOMING</au><au>WANG SHENGLI</au><au>LI YANKUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Preparation method of low-temperature integrated mold-pressing conductive rubber plate for cover plate of electronic case</title><date>2016-04-20</date><risdate>2016</risdate><abstract>The invention relates to a preparation method of a low-temperature integrated mold-pressing conductive rubber plate for a cover plate of an electronic case, belongs to the technical field of conductive rubber plate preparation and provides a preparation method of the low-temperature integrated mold-pressing conductive rubber plate which comprehensively improves the overall salt mist resisting performance of the case. The preparation method comprises steps as follows: an aluminum plate is fixed on a handling frame and is coated with an adhesive by an automatic rubber coating machine, after the adhesive is cured and does not flow, a sizing material is laid to a mixing mill and is prepared from rubber, a vulcanizing agent and composite conductive powder through mixing, the resistance value is smaller than 2 m omega, the materials are subjected to one-time pressing composite forming in an automatic vulcanizer after laying, parameters in the automatic vulcanizer are as follows: the vulcanizing temperature is 40-70</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Preparation method of low-temperature integrated mold-pressing conductive rubber plate for cover plate of electronic case |
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