Preparation method of low-temperature integrated mold-pressing conductive rubber plate for cover plate of electronic case

The invention relates to a preparation method of a low-temperature integrated mold-pressing conductive rubber plate for a cover plate of an electronic case, belongs to the technical field of conductive rubber plate preparation and provides a preparation method of the low-temperature integrated mold-pressing conductive rubber plate which comprehensively improves the overall salt mist resisting performance of the case. The preparation method comprises steps as follows: an aluminum plate is fixed on a handling frame and is coated with an adhesive by an automatic rubber coating machine, after the adhesive is cured and does not flow, a sizing material is laid to a mixing mill and is prepared from rubber, a vulcanizing agent and composite conductive powder through mixing, the resistance value is smaller than 2 m omega, the materials are subjected to one-time pressing composite forming in an automatic vulcanizer after laying, parameters in the automatic vulcanizer are as follows: the vulcanizing temperature is 40-70