Brazing method of water-load isolation ceramic chip and brazing fixture
The invention discloses a brazing method of a water-load isolation ceramic chip and a brazing fixture. The ceramic chip and a square-wave guide tube are welded. The ceramic chip is arranged inside the square-wave guide tube. Locating pieces are uniformly arranged on the periphery of the square-wave...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a brazing method of a water-load isolation ceramic chip and a brazing fixture. The ceramic chip and a square-wave guide tube are welded. The ceramic chip is arranged inside the square-wave guide tube. Locating pieces are uniformly arranged on the periphery of the square-wave guide tube. Molybdenum wires twine around surfaces of the locating pieces so as to fasten the locating pieces. A brazing solder is placed on the ceramic chip. The components are put into a hydrogen furnace, and thermal insulation is carried out at 780+/-5 DEG C for 1-3 min so as to finish the brazing. According to the invention, fit clearance between the ceramic chip and the square-wave guide tube is accurately controlled, the locating pieces are arranged on the outside of the thin wall of the square-wave guide tube, and the locating pieces are fastened with the molybdenum wires. Then, during brazing of the square-wave guide tube and the square ceramic chip, expansion amount of the oxygen-free copper square-wave gu |
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