Method for treating defects of half solder mask bridge in solder mask production process

The invention discloses a method for treating defects of a half solder mask bridge in a solder mask production process. The method is characterized by comprising the specific processes: (1) cutting, wherein a panel of which the substrate thickness is 1.0mm and the base copper thickness is 1/2OZ is s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DONG BUQUAN, HUANG JIMAO, LENG YAJUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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