Method for treating defects of half solder mask bridge in solder mask production process

The invention discloses a method for treating defects of a half solder mask bridge in a solder mask production process. The method is characterized by comprising the specific processes: (1) cutting, wherein a panel of which the substrate thickness is 1.0mm and the base copper thickness is 1/2OZ is selected as an L1/2 layer, and the dimension of a substrate is 540*615mm; (2) drilling, namely carrying out targeting, positioning pin knocking and drilling; (3) treating of an outer layer, namely fabricating an outer line; (4) electroplating, namely electroplating a pattern; (5) external inspection, namely inspecting the outer line; and (6) treatment of a solder mask and characters, namely carrying out printing, exposing, developing and baking. Compensation is carried out aiming at the top end of the half solder mask bridge to increase effective adhesion area of the top end; and protection is carried out on the half solder mask bridge. According to the method for treating defects of the half solder mask bridge in t