Semiconductor Module with Gripping Sockets, and Methods for Gripping, for Moving and for Electrically Testing a Semiconductor Module

Semiconductor Module with Gripping Sockets, and Methods for Gripping, for Moving and for Electrically Testing a Semiconductor Module

One aspect of the invention relates to a semiconductor module (100) with an outer housing (6) having four side walls (61, 62, 63, 64), and a circuit carrier (2), which is mounted on the outer housing and has an upper side (2t) and a lower side (2b) opposite the upper side (2t). A semiconductor chip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RENE CORDES, CHRISTOPH KOCH, MICHAEL LARISCH, SVEN SCHENNETTEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:One aspect of the invention relates to a semiconductor module (100) with an outer housing (6) having four side walls (61, 62, 63, 64), and a circuit carrier (2), which is mounted on the outer housing and has an upper side (2t) and a lower side (2b) opposite the upper side (2t). A semiconductor chip (1) is arranged on the upper side (2t) and in the outer housing (2t). A first gripping socket (7), which is formed as an indentation, extends from the outer side of the outer housing (6) into the first side wall (61) of the side walls (61, 62, 63, 64).