Multistage semiconductor thermoelectric cooling assembly

The invention relates to a multistage semiconductor thermoelectric cooling assembly which comprises a ceramic substrate, current guide pieces, N type semiconductors, P type semiconductors and current guide strips. The multistage semiconductor thermoelectric cooling assembly is formed from a first stage of semiconductor thermoelectric cooling assembly to an Nth stage of semiconductor thermoelectric cooling assembly in a stacking manner, and ceramic substrate bodies are fixedly bonded between layers. The sizes of the ceramic substrate are gradually reduced from the lower layer to the upper layer to be in a pagoda shape. A double-side metallization design method is adopted in the ceramic substrate bodies between all the stages. The current guide pieces are fixedly bonded to the ceramic substrate reasonably and orderly. The N type semiconductors and the P type semiconductors are fixedly bonded to the current guide pieces respectively. The N type semiconductors and the P type semiconductors in each layer are seque