Wiring board and electronic device

This wiring board (1) is provided with: an insulating base (11) that has a lateral surface having an incision part (12); an electrode (13) that is provided on the inner surface of the incision part (12); and a wiring conductor (15) that is provided within the insulating base (11) or on the surface o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MURAKAMI KENSAKU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This wiring board (1) is provided with: an insulating base (11) that has a lateral surface having an incision part (12); an electrode (13) that is provided on the inner surface of the incision part (12); and a wiring conductor (15) that is provided within the insulating base (11) or on the surface of the insulating base (11) and is electrically connected to the electrode (13) via a connection conductor (14). The width of the incision part (12) is larger than the depth thereof, and the connection conductor (14) is connected to the electrode (13) at an end of the incision part (12) in the width direction. An electronic device according to the present invention is provided with this wiring board (1) and an electronic component (2) that is mounted to the upper surface of this wiring board (1).