Lamination method of PCB, and PCB

The invention discloses a lamination method of a PCB, and a PCB. The method comprises the following steps: according to a designed maximum transmission rate of PCB signals, obtaining a maximum length of VIA-Stub through calculation; according to the thickness of the PCB and a layer of wiring, selecting the length of longest VIA-Stub; according to a maximum through hole length required by a pressing stress requirement of a crimp connector, determining the through hole length after backdrilling; subtracting the length of the longest VIA-Stub from the through hole length after the backdrilling to obtain an effective transmission length of a hole; and according to the thickness of a medium material, the length of the longest VIA-Stub, the effective transmission length of the hole and a backdrilling length, determining the thickness of each layer in the VIA-Stub, the thickness of each layer corresponding to the effective transmission length of the hole and the thickness of each layer corresponding to the bakdrilling length. The method provided by the invention can adjust different lamination so as to satisfy the requirement for the length of the VIA-Stub corresponding to a corresponding rate.