Photosensitive resin composition, and dry film and printed circuit board using the same

The present invention provides a photosensitive resin composition, and a dry film and printed circuit board using the same. Specifically, provided are a photosensitive resin composition, a dry film thereof, and a printed circuit board containing cured film formed by adopting the same The dry film of the photosensitive resin composition has excellent finger-touch tack-free property, soldering-flux heat resistance, chemical gold-plating resistance, and electrical isolation, and particularly is capable of forming the cured film, such as the the solder resist capable of preventing from the ion migration in the fine pitch circuit. The alkaline image-development photosensitive resin composition containing the resin (B) containing the carboxylic group and photo-polymerization initiator (D), further comprises the lamellar double hydroxide (A), preferably the hydrotalcite, while even more better containing the vinyl unsaturated-group compound (C). The best is to contain the thermo-curable ingredient (E) to prepare the photo-curable and thermo-curable resin composition.