Method for preparing high-performance metallic network transparent conducting electrode through metal plating method
The invention discloses a method for preparing a high-performance metallic network transparent conducting electrode through a metal plating method. The method includes the following steps: (1) a fracturing sacrificial layer template is prepared on a substrate; (2) a metallic conducting seed layer is...
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Zusammenfassung: | The invention discloses a method for preparing a high-performance metallic network transparent conducting electrode through a metal plating method. The method includes the following steps: (1) a fracturing sacrificial layer template is prepared on a substrate; (2) a metallic conducting seed layer is deposited on the fracturing sacrificial layer template; (3) the fracturing sacrificial layer is removed to form a metallic conducting seed layer network; and (4) metal is continuously deposited on the metallic conducting seed layer through the metal plating method, a continuous metal network with the larger thickness and the lower resistance is formed, and therefore the high-performance metallic network transparent conducting electrode is prepared. The transparent conducting electrode is mainly obtained through the metal plating method, the metal plating method belongs to a chemical liquid phase method, the preparing process is simple, resource consumption is low, and the high-performance metallic network transparent conducting electrode is suitable for large-area continuous preparation. The prepared transparent conducting electrode has the extremely-low surface resistance and the better light transmittance; meanwhile, the mechanical property and the environmental stability are good, the transparent conducting electrode is a beneficial replacer of a traditional metallic oxide electrode, and it is expected that the method is used for industrialization of the large-area transparent conducting electrode. |
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