Scaling powder used for high-precision nanometer soldering paste

The invention discloses scaling powder used for high-precision nanometer soldering paste. The raw materials of the scaling powder comprise, by mass, 20%-30% of solvent, 30%-50% of rosin, 3%-8% of surfactant, 2%-5% of thixotropic agents, 5%-10% of organic acid, 2%-5% of organic amine and 2%-5% of inhibiter. Compared with the prior art, the scaling powder used for the high-precision nanometer soldering tin paste has the advantages that 1, each grain of tin powder is wrapped in the scaling powder and makes entire contact with the scaling powder, the tin powder cannot adhere to a net or a scraper in the printing process, and the defects of skipping printing and lessening soldering paste are decreased; 2, the friction among the tin powder is reduced through nanometer particles on the surface of the tin powder, and the printing service life of the soldering paste is prolonged; 3, the thixotropic agents forme a fine anti-setting net-shaped structure, and big crystals cannot be separated out to cause the phenomenon of false thickening; and 4, each grain of the tin powder in the soldering paste keeps in good contact with the scaling powder by adding polyamide resin nanometer powder, and the soldering efficiency of the scaling powder is improved.