Method for cutting full-back-contact crystalline silicon solar cell
The invention relates to a method for cutting a full-back-contact crystalline silicon solar cell, and the method is used for cutting the whole solar cell into small pieces. The method comprises the steps: setting a cutting parameter of a solar laser scribing machine; enabling the front of the solar...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention relates to a method for cutting a full-back-contact crystalline silicon solar cell, and the method is used for cutting the whole solar cell into small pieces. The method comprises the steps: setting a cutting parameter of a solar laser scribing machine; enabling the front of the solar cell to face upwards and to be fixed a right-angle cutting platform of the laser scribing machine through vacuum absorption; setting a cutting width parallel to a busbar to be integral multiples of the width of a positive-negative busbar; carrying out cutting under the condition that the cutting depth is less than the thickness of the solar cell; marking the positive and negative electrode; and breaking the pieces off. The method can effectively improve the yield of solar cells, improves the production efficiency of the solar cells, also can prevent the positive and negative electrodes of the solar cells from going wrong, and provides a reliable guarantee for the subsequent high-speed and high-quality manufacturing of a solar cell module. |
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