Packaging improvement structure for LED and improvement method thereof

The present invention provides a packaging improvement structure for an LED (Light Emitting Diode) and an improvement method thereof. The packaging improvement structure comprises a pedestal, a plurality of nano metal particles and an LED unit; wherein a containing space is arranged in the pedestal in an indenting way, the containing space has a bottom surface and at least one side surface surrounding the bottom surface; the plurality of nano metal particles cover the bottom surface or the side surface; the LED unit is arranged in the containing space. The nano metal particles reflect/scatter lights emitted from the LED unit, and the diameter of each nano metal particle is less than 10 nanometers, so that electrical insulation is achieved. In this way, through adoption of characteristics of the metal material and the nanoscale, the lights emitted from the LED unit can be reflected/scattered by the nano metal particles to achieve a good light condensing effect, and as an additional insulating material is not in need, the packaging improvement structure of the present invention has the advantages of simple manufacturing process, and reduced material consumption.