Hot melt adhesive based on low melting point polypropylene homopolymers

A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70%> by weight of a polypropylene homopolymer having a DSC melting point of less than 100 DEG C; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point...

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Bibliographische Detailangaben
Hauptverfasser:	RACHOW LIANNE, HAMANN RICHARD
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70%> by weight of a polypropylene homopolymer having a DSC melting point of less than 100 DEG C; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95 DEG C to about 140 DEG C; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50%> of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi- crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163 DEG C (325 DEG F).