Heat resistant polyamide compositions

Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol.

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Bibliographische Detailangaben
Hauptverfasser:	THOMPSON JENNIFER LEIGH, DUNCAN ANDREW JAY, MESSMORE BENJAMIN WEAVER
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol.