LIQUID COATING METHOD AND LIQUID COATING APPARATUS

The present disclosure discloses a liquid coating method and a liquid coating apparatus which are capable of achieving better uniformness in the film thickness of a coating film formed on a surface of a substrate. The coating processing includes: a process of coating the coating liquid in a spiral form on the surface (Wa) of the substrate (W) by ejecting the coating liquid from the ejection nozzle (N) while moving the ejection nozzle (N) in a predetermined direction along the surface (Wa) of the substrate (W) between the rotary axis and a peripheral edge of the substrate (W) during the rotation of the substrate (W); a process of making a linear velocity at an ejection position of the coating liquid from the ejection nozzle (N) substantially constant by reducing a number of rotations of the substrate (W) as the ejection position is positioned closer to the peripheral edge of the substrate (W) within the surface (Wa) of the substrate (W); and a process of making an ejection flow rate of the coating liquid ejected from the ejection nozzle (N) substantially constant by changing a gap between an ejection port of the ejection nozzle (N) with respect to the surface (Wa) of the substrate (W) based on a change of a physical quantity at the ejection nozzle (N) that is ejecting the coating liquid.