Method for dividing bonded substrate

The present invention provides a method for dividing a bonded substrate. The method comprises: a stage of irradiating laser to a sealing part (12) to form a cutting guide line groove (H1); a stage of irradiating laser to the sealing part (12) at the position isolated from the cutting guide line groo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEO,YONG SIK, KIM,PAN GYUM
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!