Method for dividing bonded substrate

The present invention provides a method for dividing a bonded substrate. The method comprises: a stage of irradiating laser to a sealing part (12) to form a cutting guide line groove (H1); a stage of irradiating laser to the sealing part (12) at the position isolated from the cutting guide line groo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SEO,YONG SIK, KIM,PAN GYUM
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The present invention provides a method for dividing a bonded substrate. The method comprises: a stage of irradiating laser to a sealing part (12) to form a cutting guide line groove (H1); a stage of irradiating laser to the sealing part (12) at the position isolated from the cutting guide line groove (H1) to form a determined cutting guide line groove (H2), and a stage of cutting an upper glass part (9) and a lower glass part (8) along the determined cutting guide line groove (H2) through a cutting wheel (70). The method for dividing the bonded substrate is capable of furthest reducing the needless end material part of the substrate when a liquid crystal substrate is divided and capable of obtaining a smooth divided surface.