Low-shrinkage polypropylene composite material and preparation method thereof

The invention belongs to the technical field of plastic processing, and concretely relates to a low-shrinkage polypropylene composite material. The material is prepared from the following raw materials in parts by mass: 59.5-89.95 parts of polypropylene resin, 10-35 parts of metallocene linear low d...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN ZHINENG, CHEN HUALAI, WANG XIULI, WANG XIAOLEI, LI LI, LI YANLIANG, HUANG FENG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention belongs to the technical field of plastic processing, and concretely relates to a low-shrinkage polypropylene composite material. The material is prepared from the following raw materials in parts by mass: 59.5-89.95 parts of polypropylene resin, 10-35 parts of metallocene linear low density polyethylene, 1-5 parts of a flexibilizer and 0.05-0.5 part of talcum powder. The composite material is prepared from a mixture of metallocene linear low density polyethylene, the flexibilizer and talcum powder and the low-shrinkage polypropylene through blending modification, the polypropylene large shrinkage problem is solved, operation is simple, and the composite is widely applicable to direct injection molding production of high-grade parts with relatively high requirement on shrinkage and applied to re-modified base resin. The invention also provides a preparation method for the composite material, and the preparation method is reasonable in technology.