Edging mechanism

The invention relates to an edging mechanism. Primarily, a fluid pressure cylinder conducts buffering pushing and abutting on a grinding head rotating mechanism and then on a grinding head connected with the grinding head rotating mechanism; buffer and response of fluid compression can be obtained t...

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Bibliographische Detailangaben
1. Verfasser: XIE PEIHONG
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to an edging mechanism. Primarily, a fluid pressure cylinder conducts buffering pushing and abutting on a grinding head rotating mechanism and then on a grinding head connected with the grinding head rotating mechanism; buffer and response of fluid compression can be obtained through resistance generated by changes of materials and shape of a workpiece, and the workpiece or the grinding head can be protected from being excessively damaged though the grinding head directly or suddenly abuts against the workpiece; the fluid pressure cylinder can easily and continuously provide fluid pressure, so that the pressure is kept to be a preset value all the time; accordingly, the edging mechanism can easily and continuously maintain constant buffering effect, and though the pressure is unstable at one moment, the pressure can be kept to be the preset value all the time as the pressure can be rapidly and continuously supplied, so that the stable buffer is obtained.