Stripping device and stripping method of laminate and method for manufacturing electronic device

The invention provides a stripping device and a stripping method of a laminate and a method for manufacturing an electronic device. The stripping device of the laminate has a stripping cutter, wherein for the rectangular laminate to which a first substrate and a second substrate are adhered in a str...

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Bibliographische Detailangaben
Hauptverfasser:	HIROSHI UTSUGI, TAKIUCHI KEI, ITO YASUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention provides a stripping device and a stripping method of a laminate and a method for manufacturing an electronic device. The stripping device of the laminate has a stripping cutter, wherein for the rectangular laminate to which a first substrate and a second substrate are adhered in a stripping manner, an cut edge of the stripping cutter is inserted by a predetermined quantity from a corner cutting part of a corner of the laminate to an interface between the first substrate and the second substrate, thus a stripping starting part is manufactured in the interface; and a stripping part in which the laminate is stripped in turn in the interface through taking of the stripping starting part as a starting point, and the cutter edge of the stripping cutter is inserted in the interface after in contact with an obtuse angle corner part of the obtuse angle corner parts at two ends of the corner cutting part in a point contact manner.