HEAT SEALABLE MULTILAYER FILM

At heat sealable multilayer film includes a cohesive failure heat seal layer (1) that includes a resin composition including 75 to 85 wt % of a propylene polymer (A) and 15 to 25 wt % of an ethylene polymer (B) (based on the total of (A) and (B) of 100 wt %), and a support layer (2) including a prop...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEISHI ICHIRO, SHIMIZU TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	At heat sealable multilayer film includes a cohesive failure heat seal layer (1) that includes a resin composition including 75 to 85 wt % of a propylene polymer (A) and 15 to 25 wt % of an ethylene polymer (B) (based on the total of (A) and (B) of 100 wt %), and a support layer (2) including a propylene block copolymer (C). ethylene polymer (B) is high pressure method low density polyethylene with MFR (JIS K 7210, temperatue of 190DEG C) less than 9g/10 minutes; melting point of propylene block copolymer of the support layer is higher than the melting point of propylene polymer of cohesive failure heat seal layer.