Plastic packaging mould with irregular-shaped tooth sockets and method for removing excessive glue

The invention provides a plastic packaging mould with irregular-shaped tooth sockets and a method for removing excessive glue. The plastic packaging mould comprises a mould body and at least one tooth socket, wherein the tooth sockets are formed on four sides of the mould body and used for accommoda...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU WEI, YANG XIAORUI, JIN XINCHENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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