Copper-fine-particle dispersion liquid, conductive-film formation method, and circuit board

Provided is a copper-fine-particle dispersion liquid with which photosintering can be used to form, upon an inorganic base material, a conductive film exhibiting excellent adhesive properties. This copper-fine-particle dispersion liquid (1) includes a dispersion medium and copper fine particles (11)...

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Bibliographische Detailangaben
Hauptverfasser:	ARIMURA HIDETOSHI, KUDO TOMIO, KAWATO YUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	Provided is a copper-fine-particle dispersion liquid with which photosintering can be used to form, upon an inorganic base material, a conductive film exhibiting excellent adhesive properties. This copper-fine-particle dispersion liquid (1) includes a dispersion medium and copper fine particles (11). The copper fine particles (11) are dispersed in the dispersion medium. The copper-fine-particle dispersion liquid (1) includes an adhesion improver for improving adhesive properties between a base material, and a conductive film (4) to be formed upon the base material by photosintering the copper fine particles (11). The base material is an inorganic base material (3). The adhesion improver is a phosphorus-containing compound. Accordingly, the adhesion improver improves the adhesive properties between the conductive film (4) and the inorganic base material (3).