Pre-Applied Underfill

Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies com...

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Bibliographische Detailangaben
Hauptverfasser:	CALVERT, JEFFREY M, DHOBLE, AVIN V, BARR, ROBERT K, ANZURES, EDGARDO, LEI, HERONG, FLEMING, DAVID, CHOUBEY, ANUPAM
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.