Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste

The invention relates to tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste, and the tin-alloy powder is characterized by being prepared from the following raw materials: 2.0 to 4.5 percent of Ag, 0.5 to 1.1 percent of Cu, 2.0 to 5.0 percent of Bi, 0....

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Bibliographische Detailangaben
Hauptverfasser:	FANG XIBO, FANG HANKAI, LIANG JINGSHAN, XIONG YOUDE, FANG HANKUAN
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste, and the tin-alloy powder is characterized by being prepared from the following raw materials: 2.0 to 4.5 percent of Ag, 0.5 to 1.1 percent of Cu, 2.0 to 5.0 percent of Bi, 0.01 to 0.1 percent of Ce, 0.001 to 0.01 percent Nd and the balance of Sn, the tin-alloy powder is prepared into soldering paste, and the welding spot has the advantages and effects of resistance to high temperature, anti-fatigue performance, firm welding spot after welding, no cracking and shedding, good malleability, and anti-corrosion capacity.