Preparation method of high heat dissipation aluminum based copper clad laminate

The present invention provides a preparation method of high heat dissipation aluminum based copper clad laminate and relates to the technical field of heat dissipation. A key technology of ''setting high thermal plastic'' is employed; and a copper foil layer, a high thermal conductivity dielectric layer, an aluminum-based plate and a high heat dissipation adhesive layer are sequentially bonded. The method is as below: coating high thermal conductivity dielectric layer on one side of the aluminum-based plate; bonding the copper foil layer; coating the high heat dissipation adhesive mixed from aluminum plate on the other side of the aluminum-based plate 20-50 parts by weight of polyimide resin, 1-2 parts by weight of a dicyandiamide curing agent, 30-100 parts by weight of an acetone solvent, 10-50 parts by weight of nano carbon powder and carbon balls, 5-10 parts by weight of graphene, 5-10 parts by weight of boron nitride, 5-10 parts by weight of silicon carbide and 20-30 parts by weight of magnesium hydroxide; baking at 150 DEG C for 1 h to obtain the finished product of high heat dissipation aluminum-based clad laminate for heat dissipation. The method has the advantages of simple process, good effect, low cost and easiness to promotion.