Submount assembly integration

Submount assembly integration

In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for...

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Hauptverfasser: GAGE EDWARD CHARLES, ZHONG LIJUAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
PHYSICS
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creator GAGE EDWARD CHARLES
ZHONG LIJUAN
description In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
PHYSICS
title Submount assembly integration
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