Submount assembly integration

In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GAGE EDWARD CHARLES, ZHONG LIJUAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PHYSICS
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Beschreibung
Zusammenfassung:	In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.