Manufacturing method of semi-flexible circuit board

The invention aims at providing a manufacturing method of a semi-flexible circuit board. The manufacturing method is convenient to manufacture, simple in structure, free of a connector, low in cost and high in reliability. The method comprises the following steps: (1) core plate manufacturing, namely blanking, inner layer manufacturing, depth-controlled slotting of a core plate and browning; (2) PP manufacturing, namely blanking and PP notching; (3) circuit board manufacturing, core plate and PP combination, drilling, hole copper plating, outer patterning, solder mask, surface treatment, characters, molding, depth-controlled slotting (milling a Semi-Flex region), electrical testing, final inspection and packaging. The manufacturing method can be applied to the field of circuit board technologies.