Method for manufacturing base material having recessed pattern, composition, method for forming electrically conductive film, electronic circuit and electronic device

Provided is a method for manufacturing a base material having a recessed pattern used for extending wetting of a film-forming ink while suppressing bleeding when forming a high-definition pattern, a composition used in manufacturing the base material, a method for forming an electrically conductive film, an electronic circuit, and an electronic device. The method for manufacturing the base material having the recessed pattern includes: (i) a step for applying, on a substrate (1), a composition including a polymer having an acid-dissociable group and an acid generator to form a coating (2); and (ii) a step for irradiating a localized portion of the coating (2). The method for manufacturing the electrically conductive film involves applying, on the recessed pattern formed in the exposed portion of the coating film (2), an ink for forming an electrically-conductive film, and heating the ink to form a pattern (6). The method for forming the electrically conductive film is used for providing the electronic circuit and the electronic device.