Polishing head

The invention provides a polishing head. The polishing head comprises a polishing head base, a fixing ring on the surface of the polishing head base and a gasket connecting the fixing ring and the polishing head base, wherein the gasket is elastic in the direction perpendicular to the surface of the polishing head base. The gasket is arranged to be elastic in the direction perpendicular to the surface of the polishing head base in order to guarantee that a wafer is not affected by the height of the fixing ring and can make complete contact with a polishing platform. The polishing head has the advantages that as pressure exists between the polishing head base and the polishing platform, after the wafer is thinned to the degree that the fixing ring makes contact with the polishing platform, even though the fixing ring makes contact with the polishing platform, it is still guaranteed that the wafer and the polishing platform make complete contact in the state of existence of pressure as the gasket is elastic. Therefore the problem of breakage of the wafer due to uneven stress is avoided.