Evaporation device of ultrathin high-pressure-resistant metallized film

The invention discloses an evaporation device of an ultrathin high-pressure-resistant metallized film. The evaporation device comprises an evaporation mechanism used for heating and evaporating metal, a wire feeding mechanism used for conveying evaporation raw metal wires into the evaporation mechan...

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1. Verfasser: SONG RENXIANG
Format: Patent
Sprache:eng
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Zusammenfassung:The invention discloses an evaporation device of an ultrathin high-pressure-resistant metallized film. The evaporation device comprises an evaporation mechanism used for heating and evaporating metal, a wire feeding mechanism used for conveying evaporation raw metal wires into the evaporation mechanism and control mechanisms used for controlling the wire sending speed of the wire sending mechanism, wherein the evaporation mechanism comprises a plurality of evaporation boats; the wire sending mechanism comprises a main driving shaft and a plurality of transmission components driven by the main driving shaft; each of the transmission components comprises a wire sending wheel; each of the control mechanisms comprises a signal collector used for detecting the evaporation speed of the corresponding evaporation boat, a signal processor used for processing the detection signal collected by the signal collector and outputting a control signal, and a signal actuator used for receiving the control signal output by the signal processor and adjusting the wire sending speed of the corresponding wire sending wheel through adjusting the transmission ratio of the corresponding transmission component. According to the evaporation device of the ultrathin high-pressure-resistant metallized film, the uniformity of evaporation thickness of a metallized film metal coating can be improved.