Electronic component installation apparatus

The invention provides an electronic component installation apparatus capable of further increasing numbers of electronic components installed on a base plate (8). In the electronic component installation device (10), a lead wire is inserted into an insertion hole on the base plate via a lead-wire-remaining type electronic component main body, so installation is finished; the electronic component installation device (10) comprises an electronic component feeding device (90) feeding a leading-wire type electronic component, a carrying head (15) having a suction nozzle (32) maintaining the lead-wire type electronic component supplied by the electronic component feeding device, a carrying head moving mechanism (16) enabling the carrying head (15) to move and a lead wire processing device (100) having a bend part (106) abutted against the lead wire of the lead-wire type electronic component. The lead can be freely supported; the bending part is driven by the lead wire processing device to move; and the lead wire is essentially bend into a right angle when a posture of the lead-wire type electronic component is maintained.