Wafer level packaging method and wafer level packaging structure

The invention provides a wafer level packaging method and a wafer level packaging structure. The wafer level packaging method is applied on a plurality of photodiode crystal particles, and comprises the following steps: a wafer is provided and the wafer has a first surface; a plurality of bearing spaces are formed on the first surface of the wafer, the top opening of each bearing space is located on the first surface, the bottoms of the bearing spaces are used for bearing the photodiode crystal particles; an optical material layer is formed on the wafer, the optical material layer covers the photodiode crystal particles and has a micro lens array structure. The micro lens array structure is located on the photodiode crystal particles and is used for transmission of light emitted from the photodiode crystal particles and light type definition.