Packaging structure for FBAR device and manufacturing method thereof

The invention provides a packaging structure for an FBAR device. The packaging structure comprises a substrate, at least one first groove, bonding pads, second grooves, a first electrode layer, a second electrode layer and at least one FBAR device plate, wherein the at least one first groove is form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU JIE, YANG QINGHUA, OU YI, LAI YAMING, WU GUANGSHENG, ZHU LI'NA, CHEN QING, GU CHENGXIAN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention provides a packaging structure for an FBAR device. The packaging structure comprises a substrate, at least one first groove, bonding pads, second grooves, a first electrode layer, a second electrode layer and at least one FBAR device plate, wherein the at least one first groove is formed in the upper surface of the substrate; one bonding pad is formed on two sides of the first groove respectively; each second groove is formed in the surface of the corresponding bonding pad; the FBAR device is bonded with the bonding pads, and the electrodes of the FBAR device are arranged in the first groove; the first electrode layer is formed on the lower surface of the substrate, and overlays the tops and the side walls of the second grooves at the same time; and the second electrode layer is formed on the lower surface of the first electrode layer. Correspondingly, the invention also discloses a manufacturing method of the packaging structure for the FBAR device. Through the implementation of the packaging structure for the FBAR device and the manufacturing method of the packaging structure for the FBAR device, the difficulty of the packaging technology can be reduced, and the production technology and production cycle are optimized, so that the packaging cost is greatly reduced.