Thermal treatment apparatus and thermal treatment method

The invention provides a thermal treatment apparatus and a thermal treatment method which can provide even and fast heating to a substrate which has warpage generated during the temperature raising process. According to the thermal treatment apparatus (1), a heating plate (2) of which the temperature is adjusted to a heating temperature is used for carrying the substrate (W) which recovers to a flat shape after a warpage occurs during the temperature raising process. A supporting component (3) supports the substrate (W) from a lower surface side of the substrate (W) and performs lifting by using a lifting mechanism (31,32) between a joint position on the above side and a position on the below side of the heating plate (2). A controller (4) performs control so as to enable the substrate (W), with the descending period from the joint position, on the above side of the heating plate (2), to use heat from the heating plate (2) to raise the temperature of the substrate (W) to a temperature whereby a warpage occurs. Next, after a recovery period during which time the substrate (W) recovers to a flat shape, the substrate (W) is made to be carried by the heating plate (2).