Laminated ceramic electronic component mounting structure

The invention provides a laminated ceramic electronic component mounting structurecapable of reducing nosie witout cutting electrode lands. The laminated ceramic electronic component mounting structure (1) includes a laminated ceramic electronic component (2) including a ceramic body (3), first and second inner electrodes (4a,4b) in the ceramic body (3) including opposed portions (4a1, 4b1)including at least portions of which are opposed to each other in a thickness direction of the ceramic body, a first terminal electrode (5a) electrically connected to the first inner electrode (4a), and a second terminal electrode (5b) electrically connected to the second inner electrode (4b); and a circuit board (6) including first and second electrode lands (7a, 7b) electrically connected to the first and second terminal electrodes and on which the laminated ceramic electronic component (2) is mounted, wherein widths of the first and second electrode lands (7a, 7b) are smaller than widths of the first and second inner electrodes (4a, 4b)at the opposed portions.