Novel organic silicon heat conduction adhesive and preparation method thereof

The invention discloses a novel organic silicon heat conduction adhesive. The novel organic silicon heat conduction adhesive comprises, by weight, 30-60 parts of organic silica gel, 10-30 parts of polyamide, 5-15 parts of polyacrylate, 3-10 parts of sodium silicate, 1-3 parts of nano heat conduction...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WU XIFEI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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