Novel organic silicon heat conduction adhesive and preparation method thereof

The invention discloses a novel organic silicon heat conduction adhesive. The novel organic silicon heat conduction adhesive comprises, by weight, 30-60 parts of organic silica gel, 10-30 parts of polyamide, 5-15 parts of polyacrylate, 3-10 parts of sodium silicate, 1-3 parts of nano heat conduction...

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Bibliographische Detailangaben
1. Verfasser:	WU XIFEI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention discloses a novel organic silicon heat conduction adhesive. The novel organic silicon heat conduction adhesive comprises, by weight, 30-60 parts of organic silica gel, 10-30 parts of polyamide, 5-15 parts of polyacrylate, 3-10 parts of sodium silicate, 1-3 parts of nano heat conduction packing, 0.5-2 parts of dispersing agents, 0.5-1 part of inhibitors and 1-1.5 parts of catalysts. The invention further discloses a preparation method of the organic silicon heat conduction adhesive. The prepared novel organic silicon heat conduction adhesive is good in heat conductivity, high in bonding capacity, capable of resisting wearing and high temperature, good in stability, free of poison and environmentally friendly.