Method for manufacturing semiconductor device

The invention provides a method for manufacturing a semiconductor device. The method for manufacturing the semiconductor device comprises the steps of: providing a semiconductor substrate, wherein the semiconductor substrate is provided with an aluminum bonding pad, a passivation layer is formed on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HE ZHAOWEN, ZHENG ZHAOXING, YUAN JUN
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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