Dry film containing solvent and method for applying dry film on the substrate

The invention provides a dry film containing solvent and method for applying dry film on the substrate. The dry film comprises base materials and a resin layer, wherein the resin layer comprises resin composition and solvent and the solvent content accounts for at least 5wt% of the total weight of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HUANG BOYU, LYU SHUWAN, CHEN MENGZUO, AN ZHIMIN, HE CHANGHONG, YE SHIJIE, JIANG SHUNREN, WU ZHONGREN, ZHOU MENGYAN, SHI YIZHONG
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY GENERAL PROCESSES OF COMPOUNDING HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The invention provides a dry film containing solvent and method for applying dry film on the substrate. The dry film comprises base materials and a resin layer, wherein the resin layer comprises resin composition and solvent and the solvent content accounts for at least 5wt% of the total weight of the resin layer. The dry film of the invention is applied on the substrate without using the existing vacuum film-pressing device. The dry film applying method of the invention has a simple process and a good cost-effectiveness relative to the existing technology.