Photocuring resin containing polyethoxy bisthiophenyl fluorene structure and preparation method thereof

The invention relates to the technical field of a resin and a preparation method thereof, particularly a photocuring resin containing polyethoxy bisthiophenyl fluorene structure and a preparation method thereof. The preparation method comprises the following steps: adding 9.9-(4-thiophenyl-hydroxypo...

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Bibliographische Detailangaben
Hauptverfasser: XIE ZIHUA, TAO LINHUA, ZHOU CHUANYU, HUANG SIFU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of a resin and a preparation method thereof, particularly a photocuring resin containing polyethoxy bisthiophenyl fluorene structure and a preparation method thereof. The preparation method comprises the following steps: adding 9.9-(4-thiophenyl-hydroxypolyethoxy)bis fluorene and (methyl)acrylic acid into an organic solvent, and carrying out esterification reaction by using an organic acid as a catalyst in the presence of a polymerization inhibitor and a reducer; and after the reaction finishes, carrying out salt washing, neutralization, water washing, drying and reduced pressure distillation to remove the solvent, thereby obtaining the 9.9-(4-thiophenyl-(methyl)acryloyloxypolyethoxy)bis fluorene. The polyethoxy acrylate resin containing bisthiophenyl fluorene structure is a colorless or light yellow transparent photocuring resin, has favorable heat resistance and transparency, and has different refractive index gradients.