Sensing chip packaging structure and preparation method thereof

The invention provides a low-cost and high-reliability packaging and interconnection integration scheme aiming at a sensing chip, and in particular a fingerprint identification chip. According to the scheme, conductive lines, solder plate convex blocks and solder balls are directly manufactured at t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU YUHUAN, PANG CHENG, XIE JIANYOU, YU DAQUAN, LIU WEIDONG, ZHAN LIANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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