High thermal conductivity insulating nano carbon copper foil

The invention relates to a high thermal conductivity insulating nano carbon copper foil, comprising a copper foil layer, and also comprising a high radiation nano heat dissipation layer located on the copper foil layer, and a gum layer located below the copper foil layer.

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Bibliographische Detailangaben
1. Verfasser:	QU JIEHAO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention relates to a high thermal conductivity insulating nano carbon copper foil, comprising a copper foil layer, and also comprising a high radiation nano heat dissipation layer located on the copper foil layer, and a gum layer located below the copper foil layer.