APPARATUS FOR BREAKING BRITTLE MATERIAL SUBSTRATE

The invention provides an apparatus for breaking brittle material substrates. A substrate is arranged in the longitudinal direction and the transverse direction with a functional area, and the material is separated from the surrounding material, and the end material is separated, and the resin layer is cracked. The substrate (20) is maintained on the base plate (15) and the push plate (47) is decreased, and the material is separated. Then, in the end stage separation material (15) and expansion stage (16) into the substrate and rotated. After that, the end material is separated from the carrier platform 15 to the opposite direction, and the extension head 73 to the substrate is vertical down and the resin layer is cracked, thereby separating the chip. Since the end of the material is used in the separation and inversion of the end material, the expansion of the carrier is used to reverse and expand, so the invention can obtain the effect of the whole device miniaturization and efficiency.