Coated substrate and process for cutting a coated substrate

A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphi...

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Bibliographische Detailangaben
Hauptverfasser: MICHAEL M. LI, YULEI SUN, ANTHONY J. RICHTER, RAUL A. MOLINA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.