Compositions and methods of making thin wall housings for electronic devices
The invention provides high flow and ductile thermoplastic resin compositions for the formation of thin wall articles and articles with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded articles.
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| Format: | Patent |
| Sprache: | eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention provides high flow and ductile thermoplastic resin compositions for the formation of thin wall articles and articles with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded articles. |
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