SnBiNi low-temperature lead-free brazing filler metal and manufacturing method thereof

The invention relates to SnBiNi low-temperature lead-free brazing filler metal and a manufacturing method thereof. The brazing filler metal and the method aim at solving the problem that SnBi eutectic brazing filler metal is poor in plasticity. The SnBiNi low-temperature lead-free brazing filler met...

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Hauptverfasser: WANG CHANGWEN, WANG BINBIN, WANG YANG, LIU XIYANG, LIU YANG, YUE YANXING, CUI YUANBIAO, YAN ZHIFENG, YANG MIAOSEN
Format: Patent
Sprache:eng
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Zusammenfassung:The invention relates to SnBiNi low-temperature lead-free brazing filler metal and a manufacturing method thereof. The brazing filler metal and the method aim at solving the problem that SnBi eutectic brazing filler metal is poor in plasticity. The SnBiNi low-temperature lead-free brazing filler metal comprises, by mass, 42% of Bi, 0.05% to 0.2% of Ni and the balance Sn. The method includes the steps that firstly, Ni and Sn are smelted to obtain Sn-Ni intermediate alloy; secondly, the Sn-Ni intermediate alloy, Sn and Bi are mixed and smelted to obtain Sn-Bi-Ni alloy; thirdly, the Sn-Bi-Ni alloy is polished and spun to obtain the SnBiNi low-temperature lead-free brazing filler metal. The method is used for manufacturing the SnBiNi low-temperature lead-free brazing filler metal.